Semi-automatic bonding device for touch panels
This device is designed for manually bonding glass substrates and film substrates.
This is a semi-automatic type that positions and bonds two substrates, such as glass substrates and film substrates. By operating the levers on both sides and monitoring the markers with a CCD camera, high-precision alignment can be easily achieved.
- Company：ハイテック・プレシジョン
- Price：Other
