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This device is designed for manually bonding glass substrates and film substrates.
This is a semi-automatic type that positions and bonds two substrates, such as glass substrates and film substrates. By operating the levers on both sides and monitoring the markers with a CCD camera, high-precision alignment can be easily achieved.
Stabilizing the manual bonding and jig bonding processes! Ensures stable adhesive quality regardless of who performs the work, contributing to standardization of the process and reduction of defects. Also great for small quantities and diverse products in evaluation processes!
In the bonding process using manual or jig application, are you facing issues such as quality variation due to the skill level of the operator, defects caused by air bubbles, and reduced yield? 'Lamico' is a tabletop semi-automatic bonding device that can perform everything from adhesive application to bonding with just one machine. It replaces manual processes and achieves stable bonding with reduced air bubbles, even with transparent adhesives. 【Features】 - Integrated control from adhesive application to bonding - Bonding with reduced air bubbles even with transparent adhesives - High reproducibility of adhesive quality that does not depend on the operator - Reduction of quality variation in manual and jig bonding processes - Compatible with small quantities, diverse products, evaluation processes, and precision bonding - Tabletop design allows for partial automation implementation By managing work conditions on the device side, stable quality can be ensured regardless of who is operating it. It contributes to the standardization of the bonding process, which tends to become dependent on specific individuals, and helps reduce defects and improve yield. For more details, please check the PDF by downloading the catalog or feel free to contact us.
